Design Sample

0.4MM BGA with Blind & Buried Via

SOLAR INVERTER
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

MIN.SIZE VIA – 10/20 / COMPONENTS - 453 / LAYERS – 4 / BOARD SIZE – 7.480” x 4.724” (190 x 120 mm)

CUSTOM SST Test Board
PACKAGE TYPE: RT4G150-CQ352 SST

COMPONENTS (887 0.35mm) / LAYERS – 12

MOTHER BOARD
BOARD SIZE – 98.4MM x 312MM

MIN.SIZE VIA – 6/14 / COMPONENTS - 1432 / LAYERS – 18 / INTERFACES – PROCESSOR, PCIe, RGMII, DDR3, SATA, USB, HSMA CONNECTOR,3G-SDI CABLE,3G –SDI VIDEO I/P

HSMA, DDR3 ROUTING& LENGTH MATCHING

MOTHER BOARD
BOARD SIZE – 76.2MM x 127MM

MIN.SIZE VIA – 6/12 / COMPONENTS - 517 / LAYERS – 6 / INTERFACES – SODIMM CONNECTOR, ETHERNET, SATA, USB, LCD DISPLAY, CAMERA INTERFACE

APPLICATION BOARD
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

MIN.SIZE VIA – 12/24 / COMPONENTS - 470 / LAYERS – 4 / INTERFACES – PRESSURE SENSOR, USB, BLUTOOTH

TRACKING BOARD WITH 3G CONNECTIVITY
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE – 66.8MM x 109.5MM / COMPONENTS - 655 / LAYERS – 4 / MIN.SIZE VIA – 8/18 / INTERFACES – 400MHZ MX PROCESSOR, DDR2, ETHERNET, CAN, USB, GSM, GPS, WIFI/BT, NAND FLASH

CPU BOARD
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE 4.05” x 4.275” / COMPONENTS - 692 / LAYERS – 14 / MIN.SIZE VIA – 10/20 / INTERFACES – PROCESSOR, DDR2, SDRAM CONNECTOR, USB, ETHERNET, RS232, ADC, NAND FLASH

RAM Routing with Clam Shell Type:

DDR Routing & Matching:

SPECTROMETER
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE 4.011” x 2.716” / COMPONENTS - 258 / LAYERS – 10 / MIN.SIZE VIA – 6/12 / INTERFACES – FPGA SPARTAN 14K, 12:24 DMUX WITH LVDS, FMC CONNECTOR, SMA JACK, 10+ GHz ADC, DAC

45 Gbps LIMITING AMPLIFIER

CAMERA BOARD
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE1.417” x 1.417” (36 x 36 MM) / COMPONENTS - 179 / LAYERS – 6 / MIN.SIZE VIA – 8/16 / INTERFACES – MICRO B USB, 12 x12 BGA PROCESSOR, ANTENNA 2.4 GHz

ROUTER BOARD
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE 7.7 ’’ x 9.83” / COMPONENTS - 748 / LAYERS – 18 / MIN.SIZE VIA – 10/20 / INTERFACES – QFSP28 SR/LR MODULE, OPTICAL SWITCH, IO MODULE CONNECTOR,CAUI SERDES DIFF PAIR

NOTEBOOK BOARD
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE 6” x 6” / COMPONENTS - 1026 / LAYERS – 6 / MIN.SIZE VIA – 9/18 / INTERFACES – AMD PROCESSOR, DDR3, mSATA, USB2.0&3.0, ETHERNET, RS232, LPC, SPI, SD,MINI PCIe and FLASH

LVDS Smooth (ARC) Corner Routing:

Back plane:

Power Supply:

Power Supply:

Power Supply:

MOBILE CHARGER
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE3.725” x 3.725” / COMPONENTS - 63 / LAYERS – 2 / MIN.SIZE VIA – 24/40

MOBILE CHARGER
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE3.725” x 3.725” / COMPONENTS - 63 / LAYERS – 2 / MIN.SIZE VIA – 24/40

Probe Boards:

50 Layers Board:

24 layer wafer test board:

ETS364 Wafer sort

ETS364-Quad

ETS364 Square

ETS500

TD-J750-512CH

DPSPOL 6671

J973 DPSPOL D Wing Board

UFLEX ASICS 1024 MODULE
PACKAGE TYPE:FCPBGA 24 SLOT UFLEX ASICS 1024 MODULE 2DUT

LAYERS – 40 / MIN.SIZE VIA – 14/24

Flip Chip LTCC

BOARD LEVEL RELIABILITY (LEAD FREE PACKAGES)
PACKAGE TYPE: 506 PSP/MDM9250 Mclaren_AU

BOARD SIZE– 5.511” x 1.141” (140 x 290 mm) / COMPONENTS - 346 (8 FPGA, 4 FSI MATTING CONNECTOR) / LAYERS – 28 / MIN.SIZE VIA – 10/20

Burn-In Boards AMT
PACKAGE TYPE: LT8603 UJ40 BURN-IN CIRCUIT

COMPONENTS - 1022 / LAYERS – 4 / NETS COUNT- 907

Criteria 5
PACKAGE TYPE: 152 BGA/512 GBit FLASH

COMPONENTS - 1819 / LAYERS – 8 / NETS COUNT- 1389

Verifier I (256512 pins MK2) ESD Board
PACKAGE TYPE: 300 MSP/NAPIER 0.5 TEST CHIP VERIFIER I (512)

LAYERS – 4 / NETS COUNT- 512

Infinity 8160
PACKAGE TYPE: 300 MSP/NAPIER AU

COMPONENTS - 5916 / LAYERS – 12 / NETS COUNT- 2604

TB88
PACKAGE TYPE: 105 DR-QFN (9x9mm) Iron 2G & 5G

NETS COUNT- 2030 / COMPONENTS - 2199 / LAYERS – 8

Verifier I (256512 pins MK2) ESD Board
PACKAGE TYPE: 39 BGA MK2/VERIFIER I

LAYERS – 4 / NETS COUNT- 256 /

HAST
PACKAGE TYPE: 885 PPSP/TV Fantastic 1.0 bHAS

LAYERS – 10 / COMPONENTS–1041 / NETS COUNT- 1009